The successor to the Snapdragon 888 will be called the Snapdragon 898, according to leakster Ice Universe, who also posted that the prime Cortex-X2 core will be running at 3.09 GHz.
The single X2 will most likely be paired with 3x Cortex-A710 and 4x Cortex-A510, the first ARMv9 designs. The X2 promises a 16% speed boost over the X1, the A710 upgrades are more focused on energy efficiency (+30%). And keep in mind that these numbers are if the cores are fabbed on the same process.
The 898 chipset will be manufactured at Samsung’s 4nm foundry (according to rumors), the process (named 4LPE) is developed out of the 5nm process used for the current 888 chipset. The Cat also mentioned that Qualcomm is planning a Snapdragon 898+ chipset for later next year that will move to TSMC’s 4 nm foundry.
The Snapdragon 888+ didn’t switch foundries, but it did boost its prime CPU core speed a bit – from 2.84 GHz to 3.0 GHz. Of course, that one still has the X1 core, so the upcoming chipset should have an even bigger advantage speed-wise than a simple clock speed comparison suggests.
According to a previous leak, the Snapdragon 898 will feature a next-generation GPU (Adreno 730), a X65 5G modem (the first 10 Gbps modem), as well as upgraded ISP and NPU. Several Chinese makers are allegedly already testing the 898, so the first phones with the new chip should be unveiled not long after the chip itself.
Source (in Chinese) | Via