We’re all set to cover the nubia Red Magic 7 announcement on February 17 but before the big event nubia posted several new teasers for its upcoming gaming flagship. Red Magic 7 will bring an all-new independent gaming chipset dubbed Red Core No. 1. Based on the teaser the chip will process sound, light, vibration and touch inputs.
Red Magic 7 cooling system and clip on fan
The new teasers also detailed the phone’s elaborate heat dissipation system via a teardown video as well as several new posters. Red Magic 7 will bring a multi-stage cooling system with a 20,000 RPM active cooling fan featuring enhanced air pressure and airflow with reduced noise compared to the outgoing Red Magic 6 series.
The phone will also house the largest-ever VC cooling plate covering a total area of 41,279mm² – 30% larger than its predecessor. In addition, nubia will offer a separate active cooling case. Red Magic 7 will also be the first gaming phone with an under-display camera but we did not get details if all versions will come with the fancy new UD cam nor what resolution the image sensor is.
Red Magic 7 UD camera poster
In more related news, Red Magic 7 appeared in a Geekbench listing and was also certified by the Wi-Fi Alliance. The Geekbench listing yet again confirms the Red Magic 7 will bring Qualcomm’s Snapdragon 8 Gen 1 chipset. We can also see the version in the test (NX709J) brings 16GB RAM and boots Android 12.
Red Magic 7 Geekbench and Wi-Fi Alliance listings
It managed a respectable 1,264-points in the single-core department and 3,744-points on the multi-core test. The Wi-Fi Alliance confirms the device will bring dual-band Wi-Fi- connectivity and Android 12.
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