Huawei is expected to launch its Mate 70 series later this month and it’s only natural that we start seeing more leaks ahead of the big unveiling. The latest one shows out the front design of the Mate 70 Pro/Pro+, which will once again sport three punch holes just like the Mate 60 Pro and Pro+ from last year.
This should be the same setup, with one of the cutouts housing the selfie camera and the remaining two being for the 3D ToF system used for secure face unlocks. While housed in a protective shell, the Mate 70 Pro/Pro+ from the image appears to have a flat frame instead of the rounded one from its predecessors. We can also see the device will feature a larger power button on the right-hand side.
Mate 70 Pro/Pro+ leaked image (left) and Mate 60 Pro+ (right)
The Mate 70 series is expected to feature a familiar camera design and will likely debut the Kirin 9100 chipset – rumored to be fabbed on SMIC’s N+3 process node (6nm).
Source (in Chinese)